Thermal Management of Electronics.

Abstract

The objective of this work is to use new materials and techniques to improve the thermal performance of electronic systems. The composite work will focus on corrosion protection of aluminum/graphite heatsinks and development of techniques to adequately machine continuous fiber composite material. Metal and polymer matrix composites will be developed for SEM heatsinks. Composite cardrails will also be developed using high thermal conductivity graphite fibers. Using the fact that composite materials can be CTE controlled, these materials will be used to constrain epoxy PWBs. This task will also look at various plating materials to attempt to decrease thermal contact resistance between the module guide rib and the enclosure cardrail. Alternate substrate materials, such as aluminum nitride, will be investigated for ceramic PWBs. The use of diamond will also be investigated to improve thermal performance. (jg)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1990
Accession Number
ADA291119

Entities

People

  • Kevin G. Beasley

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Coatings
  • Composite Materials
  • Computer Programs
  • Diamond Films
  • Graphitic Materials
  • Material Degradation Processes
  • Materials
  • Materials Processing
  • Metal Matrix Composites
  • Polymer Matrix Composites
  • Resistance
  • Substrates
  • Surface Roughness
  • Test Methods
  • Thermal Conductivity
  • Thermal Spraying

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Surface Engineering/Surface Coating Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics