High Flux Heat Exchanger.
Abstract
This final report documents the results of the final two phases of a four-phase program to develop a high flux heat exchanger for cooling future high-performance aircraft electronics. Phases I and II, documented in interim report WL-TR-93-2027, defined future avionics cooling requirements and summarized a trade study of applicable cooling technologies. The Phase II trade study selected the Compact High Intensity Cooler (CHIC) for further development in Phases II and IV. This report describes the design, fabrication, and testing of the CHIC. The CHIC was designed to minimize system penalties (weight, cost, etc.) to a typical advanced fighter aircraft. Design objectives included a heat exchanger shape factor meeting Standard Electronics Module Format 'E' (SEM-E) specification, local heat flux capability of 100 W/ sq cm, total module heat flux capability of 2000 W, maximum junction temperature of 90 deg C, and the use of poly alpha olefin (PAO) as the coolant. The CHIC was fabricated by diffusion bonding a stack of 24 copper alloy laminations (of eight different patterns) produced by photo-chemical etching. It was leak checked, proof-pressure tested, and then subjected to a series of thermal tests to verify performance. This was the first demonstration of 100 W/ sq cm local heat flux capability and 2000 W module capability using PAO. jg
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1994
- Accession Number
- ADA291436
Entities
People
- Dam C. Nguyen
- Edward M. Flynn
- R. S. Downing