High Performance YBCO Films.

Abstract

The major objectives of this four year program have been accomplished. A suitable low loss, low dielectric constant substrate for HTS circuitry has been identified and shown to permit the deposition of high quality YBCO films that are comparable to that achieved with lanthanum aluminate substrates. The substrate is magnesium fluoride which has a dielectric constant of 5.3 and a loss tangent of 0.0001 at 77K. The benefits of this technology are higher speed interconnects for Multi-Chip Module (MCM) assemblies applied to digital processing, higher power handling at microwave frequencies applied to multiplexers and other passive components, and lower frequency dispersion and lower loss at millimeter wave frequencies applied to antenna feed networks, T/R modules, and delay lines. We have developed a novel fabrication technique for MCM structures that features an ultra-thin YBCO-covered magnesium fluoride substrate glass bonded to a metal handle, which provides excellent mechanical support and good heat sinking characteristics. For a sample demonstration of this technology, an MCM structure with a YBCO signal plane that is suitable for microwave/millimeter wave circuitry was fabricated and tested to have excellent electrical characteristics with a YBCO film surface resistance of 1 mohm. jg p.3

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Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1995
Accession Number
ADA293045

Entities

People

  • Edgar J. Denlinger

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • 5G Wireless Networks
  • Aluminates
  • Annealing
  • Antenna Feeds
  • Antennas
  • Artificial Satellites
  • Contracts
  • Delay Lines
  • Dielectric Films
  • Dielectric Permittivity
  • Fabrication
  • Films
  • Frequency
  • Materials
  • Metals
  • Millimeter Waves
  • Superconductors

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • 5G