Intelligent Computer Based Reliability Assessment of Multichip Modules.

Abstract

A novel methodology for design assessment of MCM packages is presented using finite element analysis and a Taguchi based design of experiments technique. This methodology enables the design engineer to rapidly estimate the quality of candidate designs and thereby select better designs. The proposed method allows the designer to generate a robust finite element model of the physical process which is also numerically efficient, to identify the design parameters that are critically important to the performance of the design and also to investigate the effect of tolerances on the significant design parameters. A detailed description is presented along with a MCM design example to illustrate the proposed method.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1994
Accession Number
ADA293117

Entities

People

  • Ira R. Grosse
  • Prasanna Katragadda
  • Sandeepan Bhattacharya
  • Sarang Kulkarni

Organizations

  • University of Massachusetts Amherst

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Computational Fluid Dynamics
  • Computational Science
  • Computer Science
  • Computer-Aided Design
  • Computers
  • Engineers
  • Experimental Design
  • Failure Mode And Effect Analysis
  • Finite Element Analysis
  • Graphical User Interface
  • Lisp Programming Language
  • Manufacturing
  • Materials
  • Multichip Modules
  • Reliability
  • Statistical Analysis
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Adaptive Control and Estimation with Uncertainty in Dynamic Systems.
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design