Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs).

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Metal Core Fabrication, LTCC Ceramic Development, Thin Film Interconnect Structure Integration, Multilayer Interaction, and Reliability Studies. jg

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 13, 1995
Accession Number
ADA293183

Entities

People

  • A. H. Kumar
  • A. N. Prabhu
  • Barry J. Thaler

Organizations

  • Sarnoff Corporation

Tags

DTIC Thesaurus Topics

  • Circuit Boards
  • Composite Materials
  • Dielectrics
  • Fabrication
  • Films
  • Frequency
  • High Density
  • Lasers
  • Low Density
  • Materials
  • Materials Processing
  • Metal Matrix Composites
  • Network Topology
  • Test And Evaluation
  • Test Vehicles
  • Thick Films
  • Thin Films

Readers

  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.
  • Software Engineering
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene