Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs).

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Technology Transfer to Merchant Suppliers, Customize LTCC-M for Specific Applications, and Fabrication and Testing of Technology Demonstration Modules. (MM)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 13, 1995
Accession Number
ADA295444

Entities

People

  • A. H. Kumar
  • A. Sussman
  • Barry J. Thaler
  • H. Rivenburg
  • J. S. Prokop

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Composite Materials
  • Demonstrations
  • Fabrication
  • Failure Mode And Effect Analysis
  • Films
  • Geometry
  • Laminates
  • Manufacturing
  • Materials
  • Materials Processing
  • Materials Testing
  • Metal Matrix Composites
  • Technology Transfer
  • Test And Evaluation
  • Thick Films

Readers

  • Reinforced Composite Materials
  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.
  • Software Engineering

Technology Areas

  • Microelectronics