Nondestructive Evaluation of Sputtered-Deposited Tantalum Carbide Refractory Coatings.

Abstract

Desirable characteristics of refractory coatings for future projectile launchers include high wear resistance, high melting point, hardness, electrical conductivity, good adhesion, thermal stability, and high plasma resistance properties. Sputtered tantalum and tantalum compounds, such as tantalum nitride and tantalum carbide are being considered as future coatings to endure the high pressure, high temperature, and aggressive chemical environment of the bore. In this work, tantalum and tantalum carbide were reactively sputtered deposited from argon plasmas containing methane. Nondestructive x-ray diffraction analysis determined that body-centered-cubic (bcc) tantalum was deposited at methane concentrations below 20 percent, face-centered-cubic (fcc) tantalum carbide was deposited at methane concentrations above 25 percent, and a mixture of tantalum and tantalum carbide was deposited at the transitional 22 percent methane concentration. Coating composition, crystalline structure, particle size, preferred orientations, deposition rate, Knoop hardness, and temperature coefficient of resistivity are sensitive functions of percentage methane concentration in the sputtering-deposited process. jg p.3

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1995
Accession Number
ADA298084

Entities

People

  • J. Walden
  • S. L. Lee
  • W. J. Heffernan

Organizations

  • United States Army Armament Research, Development and Engineering Center

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Coatings
  • Diffraction
  • Diffraction Analysis
  • Materials
  • Metals
  • Military Research
  • Particle Size
  • Phase Diagrams
  • Refractory Coatings
  • Refractory Materials
  • Refractory Metals
  • Sputtering
  • Tantalum
  • Tantalum Compounds
  • Temperature Coefficients
  • X Rays
  • X-Ray Diffraction

Readers

  • Materials Science and Engineering.
  • Thin Film Deposition Science.