Multichip Modules Including Processing: A Literature Survey.

Abstract

In a review of the literature on multichip modules (MCMs), the focus was on the types of MCMs and processes required to fabricate them. The use of MCMs for connecting integrated circuit chips can improve integration density and potentially improve speed, reliability, size, and life-cycle cost, if MCMs are fabricated in sufficient volume. Particular processes produce each MCM type. Each MCM type has advantages and drawbacks. Known good dice (or chips), proper design, and adequate production volume must be evaluated for each fabrication approach.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1995
Accession Number
ADA298735

Entities

People

  • Timothy E. Griffin

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Application-Specific Integrated Circuits
  • Chemistry
  • Dielectrics
  • Fabrication
  • Integrated Circuits
  • Literature Surveys
  • Mainframe Computers
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Modules (Electronics)
  • Multichip Modules
  • Phase Transformations
  • Resins
  • Semiconductor Devices

Readers

  • Electrical Engineering
  • Software Engineering