High-Performance and Low-Cost Optical Interconnects.

Abstract

This grant developed models of optoelectronic technology to predict manufacturing cost for monolithic and hybrid integration. For the hybrid CMOS-SEED technology, the models predict that modulator yield limits the overall system yield. In addition, the models show that CMOS-SEED is lower cost than the monolithic FET-SEED, though much more expensive than conventional silicon due to the high GaAs epitaxial wafer cost. Hence, CMOS-SEED integration will be limited to small chips on MCMs. The yield models also predict the ratio of optoelectronic interconnects to transistors in a balanced system. in addition, for the same cost systems, we showed the performance. Reliability or architectural advantage necessary to make optoelectronic interconnects competitive with electronics.

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1995
Accession Number
ADA299094

Entities

People

  • Charles Stirk
  • John A. Neff

Organizations

  • University of Colorado Boulder

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Electronics
  • Manufacturing
  • Modulators
  • Optical Interconnects
  • Power Electronics
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Transistors

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics