On Mechanical Properties of Materials by Thermal Wave Imaging.
Abstract
A three year program of research was proposed to: (1) Utilize recently developed WSU fast line- scan techniques to study the temperature distribution in the vicinity of the crack tips of propagating brittle fracture cracks in structural polymer composites; (2) To utilize Wayne State University's well established box-car video thermal wave imaging technique for the purpose of studying adhesive bond strength, and (3) Exploit the concept of vector lock-in video thermal wave imaging for mechanical and thermal response of semiconductors. jg p.6
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 24, 1995
- Accession Number
- ADA299577
Entities
People
- L. D. Favro
- P. K. Kuo
- R. L. Thomas
Organizations
- Wayne State University