Techniques for On-Wafer Reliability Testing for MMICs.

Abstract

Two Compliant Interconnected Structures (CISs) have been designed and fabricated to enable accelerated DC life tests to be performed at the wafer level. The first CIS was fabricated using Kapton polyimide, the second with borosilicate glass. Both structures are capable of providing bias to the GaAs wafers at 24O C for an extended period of time. Three inch wafers that contain process test characterization vehicles, a distribution amplifier, and three stage amplifiers, were used to demonstrate the feasibility of the techniques.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1995
Accession Number
ADA299600

Entities

People

  • Yoshio Saito

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Amplifiers
  • Life Tests
  • Reliability

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Thin Film Deposition Science.