Low Defect SiC Material by Liquid Phase Electro-Epitaxial Lateral Overgrowth.
Abstract
The Phase I program was primarily an experimental study to assess the feasibility of producing high-quality silicon carbide (SiC) heteroepitaxial films on silicon substrates using a sequential combination of chemical vapor deposition and metallic solution growth. These SiC-on-silicon structures are being developed for low-cost, large-area surrogate substrates to replace SiC wafers presently used in semiconductor device applications. An epitaxial lateral overgrowth process is designed to eliminate micropipe defects and stacking faults, and substantially reduce dislocations due to thermal stress and lattice mismatch. Selective heteroepitaxy of SiC on (111) 5 was demonstrated using hexamethyldisilane (HMDS) as a precursor for Si and C. Metallic solution growth of SiC in the temperature range of 950 to 1270 deg C from copper-silicon carbon; zinc-aluminum-silicon-carbon; and nickel-silicon-carbon melts are described. Experiments showing extensive liquid-phase epitaxial lateral overgrowth of silicon on patterned, masked silicon substrates, and partial epitaxial lateral overgrowth of SiC on patterned, masked SiC are reported. These experiments indicate the feasibility of the proposed approach. In addition, an extensive literature survey and phase equilibrial modeling for solution growth of SiC was included in the Phase I work. jg p.1
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 21, 1995
- Accession Number
- ADA299780
Entities
People
- Michael G. Mauk