HTS Josephson Technology on Silicon with Application to High Speed Digital Microelectronics.
Abstract
The last chip, described in the previous monthly report, demonstrated that the Stony Brook scientists were able to fabricate working junctions and SQUIDs from thin YBCO films fabricated on silicon substrates. It was observed that the junctions were not well matched in critical temperatures. This non-uniformity is primarily attributable to non uniformities within the films. To improve the film uniformity, and to accommodate the demands of other projects, we built a new substrate heater for the deposition system, that would provide more uniform temperatures over larger substrate areas. The new heater was built to allow deposition onto 12 mm square chips, which can subsequently be diced into 4 5 mm square chips. With this arrangement, it should be possible to fabricate and test many more junctions from a single deposition and gather more and better statistics on junction properties. During this month, the AER PLD facility was down for several weeks while a new substrate heater was installed and broken in. Only one film was sent to Stony Brook for fabrication experiments. They are presently working on fabricating junctions from this chip.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 11, 1995
- Accession Number
- ADA299810
Entities
People
- Peter Rosenthal