The Reliability of Laser Reflowed Sn-Ag Solder Joints.

Abstract

The greatest concern regarding reliability of solder joints is thermomechanical fatigue (TMF). TMF results from constrained temperature changes in the environment of the electronic package and/or temperature gradients induced by power cycling of the package. Typically, electronic packages and substrates have different thermal expansion coefficients, so temperature changes result in elastic strains in the package and substrate and elastic/plastic strains in the solder joining the two together. (MM)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1993
Accession Number
ADA299852

Entities

People

  • C. H. Raeder
  • D. L. Millard
  • R. W. Messler

Organizations

  • Rensselaer Polytechnic Institute

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Climate Change
  • Creep
  • Electronics
  • Low Temperature
  • Manufacturing
  • Mechanical Properties
  • Melting Point
  • Printed Circuit Boards
  • Printed Circuits
  • Reliability
  • Shear Stresses
  • Stiffness
  • Stresses
  • Temperature Gradients
  • Thermal Expansion

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Mechanical Engineering/Mechanics of Materials.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Directed Energy
  • Microelectronics