Polymer Light Emitting Diodes on Silicon Substrates for Optical Chip Interconnects.
Abstract
Work for the last month has focussed on two main areas: (i) spinning conformal, thin films of the electroluminescent polymer onto the patterned Si circuit, and (ii) fabricating test LEDs onto substrates with electrodes made from oxidised aluminium - to mimic the electrodes fabricated on the Si circuit. (i) Conformal coatings: The design of the silicon integrated circuit (onto which the polymer LEDs will be fabricated) gives rise to a non-planar surface (see figure 1). The magnitude of the surface roughness was measured using a DEKTAK profilometer showing maximum peak-to-valley differences of 14,000A (see figure 2). This may cause problems for the LED fabrication since the polymer film is ideally only 1000A and this film must be uniform to better than 10%. Spin-coating tests were performed to determine how uniformly the polymer coats this rough surface. Figure 3 shows that the coating is reasonably conformal with the valleys being covered slightly more deeply than the peaks, resulting in a coated peak-to-valley difference of approx. 10,000A. The 40 micron repeat structure of the pixels can easily be seen. Electron microscope examination of the spin-coated layers is in progress. (ii) Devices were fabricated on Al/Al oxide substrates in order to mimic the pixel surface on the Si substrates. jg p.1
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 15, 1995
- Accession Number
- ADA299956
Entities
People
- Ian D. Parker