Waste Minimization in Circuit Board Manufacturing by Powder Coating and Metallo-Organic Decomposition.

Abstract

Free-flowing powders containing MOD compound and finely divided metals have been successfully demonstrated. This is a major step toward our goal of circuit board production by computer-controlled ink jet or laser printing. An invention disclosure has been filed. The trade name PARMOD has been selected for the materials and process.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1995
Accession Number
ADA299992

Entities

People

  • Paul H. Kydd

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Alkenes
  • Bonding
  • Circuit Boards
  • Circuits
  • Coatings
  • Conductivity
  • Fluids
  • Hazardous Waste
  • Heat Treatment
  • Manufacturing
  • Materials
  • Measurement
  • Peel Strength
  • Powders
  • Production
  • Standards

Fields of Study

  • Materials science

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy