Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs).

Abstract

This past quarter the LTCC-M Technology Transfer began to Alcoa Electronic Packaging, Inc. Initially, Alcoa will use glasses provided by SEM-COM to produce the green tape and the thick film inks. The glasses will be qualified by Sarnoff for use in LTCC-M. SEM-COM has melted 4 of the 5 custom glasses that were developed during the Phase 1 program. The glasses needed to produce the LTCC-M green tape have already been qualified by Sarnoff. The green tape formulation has been modified to accommodate the slight differences between glass formulations melted by Sarnoff and the same formulations melted by SEM-COM. The characteristics of the fired substrates made from the modified formulations are nearly identical to those previously made from Sarnoff melted glasses. An evaluation plan is in place to compare Alcoa produced green tape and thick film inks to those produced by Sarnoff. The LTCC-M technology continues to be enhanced. Processes have developed that allow cavities in the green tape to fired to the size they were punched. Additionally the adhesion of Ag and AgPd thick film top conductors has been significantly improved. Initial results from accelerated aging tests do not show any deterioration in the adhesion strength of soldered conductors. (MM)

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Document Details

Document Type
Technical Report
Publication Date
Sep 12, 1995
Accession Number
ADA300009

Entities

People

  • A. H. Kumar
  • A. Sussman
  • B. J. Thaler
  • H. C. Rivenburg
  • V. A. Pendrick

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Amplifiers
  • Circuit Boards
  • Electronics
  • Fabrication
  • Failure Mode And Effect Analysis
  • Films
  • Inverters
  • Laminates
  • Manufacturing
  • Materials
  • Materials Processing
  • Materials Testing
  • Measurement
  • Power Amplifiers
  • Technology Transfer
  • Test And Evaluation
  • Thick Films

Readers

  • Integrated Circuit Design and Technology.
  • Polymer Science and Engineering.
  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene