Liquefied Metal Jet Program (LMJP).

Abstract

Many significant technical issues have been overcome. Generation of test and evaluation coupons of 63/37 solder circuit patterns on copper coupons have been accomplished on the Phase I system. Final fabrication and assembly of the copper system has been completed tested, and several attempts to generate copper spheres have been made. (MM)

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Document Details

Document Type
Technical Report
Publication Date
Oct 12, 1995
Accession Number
ADA300143

Entities

People

  • Charles O Smith
  • John Priest
  • Nick Dringenburg
  • Patrick Dubois
  • R. E. Terrill

Organizations

  • Texas Instruments

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  • Advanced Electronics
  • Autonomy

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Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Mechanical Engineering/Mechanics of Materials.
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