0N Mechanical Properties of Materials by Thermal Wave Imaging.
Abstract
Research was carried out to: (1) Utilize WSU fast imaging techniques to study the temperature distribution in the vicinity of the crack tips of propagating cracks in polymer composites; (2) Utilize Wayne State University's thermal wave imaging techniques for studying adhesive bond strength; and (3) Exploit the concept of vector lock-in video thermal wave imaging for mechanical and thermal response of semiconductors. Key results included: (1) a Physical Review letter: "The Thermal Conductivity of Isotopically Modified Single Crystal Diamond,"; (2) Thermal wave imaging and analysis (to be published) of crack initiation and propagation in polymers; (3) Thermal wave imaging of fracture in metal/metal adhesive bonds.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 24, 1995
- Accession Number
- ADA300780
Entities
People
- L. D. Favro
- P. K. Kuo
- R. L. Thomas
Organizations
- Wayne State University