Effect of Long-Term Storage on Electronic Devices.
Abstract
This Phase II project identifies physics-of-failure based models for the dominant failure mechanisms in microelectronic packages subject to long-term storage; provides a user-friendly interactive software tool to assess the reliability of infrared (IR) and millimeter wave (MMW) sensors and associated smart munition electronic packages; and, provides a software tool to aid in defining tests for long term reliability and identifying failure mechanisms in electronic packaging methods, technologies, materials and designs. Through a questionnaire and literature search, failure mechanisms and models were identified. The questionnaire, requesting failure mechanisms, accelerated test and field reliability information for IR and MMW devices, was sent to experts from many organizations. The responses and literature search provided background for the engineering reference text titled, 'Long-term Non-operating Reliability of Electronic Devices.' Another part of this project was the development of CADMP-lle, a software tool which facilitates the physics-of-failure reliability analysis for microcircuits subject to long-term storage. Inputs to the software include geometric. material, and mounting characteristics of the device. Many storage environments are part of the software's environment database. CADMP-IIe can analyze MMW and IR package architectures using failure models and material properties that were added. The software provides a useful design aid to assess storage reliability allowing the user to determine time-to-failure and to rank the dominance of each potential failure mechanism.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1995
- Accession Number
- ADA301195
Entities
People
- Joseph Martinelli