Multi-Transducer Dummy Unit Evaluation of Polystyrene Bead Foam as an Encapsulant for Electronic Packages,

Abstract

A dummy electronic assembly without electronic components was used to measure loadings and deflections caused by 0.2, 0.3, 0.4, 0.5 and 0.6 g/cm3 densities of polystyrene bead foam during fusion and thermal cycling. Previously developed and proven transducers showed that the lower three densities caused low and safe loads and deflections, but that the highest two densities must be used with care for fragile electronic components.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1980
Accession Number
ADA301263

Entities

People

  • G. D. Swanson

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Climate Change
  • Contractors
  • Dielectric Polymers
  • Electronic Components
  • Encapsulation
  • Experimental Data
  • Low Temperature
  • Materials
  • Mechanical Properties
  • Modulus Of Elasticity
  • Polystyrenes
  • Pressure Transducers
  • Production
  • Right Angles
  • Strain Gages
  • Transducers
  • United States

Fields of Study

  • Physics

Readers

  • Aerospace Test and Evaluation
  • Polymer Science and Engineering.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems