Evaluation of Multilayer Printed Wiring Boards by Metallographic Techniques. An Illustrated Guide to the Preparation and Inspection of Plated-Through Hole Test Coupons Based on the Requirements of MIL-P-55llOD.

Abstract

This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55l lOD, "Printed Wiring Boards." Itis intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross-sectioned holes illustrate defect types, acceptable and unacceptable conditions, and methods of measurement. A procedure for specimen preparation is given, and appropriate paragraphs of the military specification are included and explained. (AN)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1986
Accession Number
ADA301449

Entities

People

  • Jane Jellison

Organizations

  • National Aeronautics and Space Administration

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Space

DTIC Thesaurus Topics

  • Circuit Boards
  • Coatings
  • Construction
  • Fabrication
  • Failure Mode And Effect Analysis
  • Fungi
  • Glass Fibers
  • Hydroxides
  • Manufacturing
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Printed Circuit Boards
  • Printed Circuits
  • Test And Evaluation

Readers

  • Business Analytics
  • Defense Technology Research and Development.
  • Metallurgy