Plastics in Electronic Packaging.

Abstract

CONTENTS: Epoxy Molding Compounds Characterization and Classification

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Document Details

Document Type
Technical Report
Publication Date
Oct 24, 1968
Accession Number
ADA301839

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Body Weight
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Fabrication
  • Manufacturing
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Molding Techniques
  • Plastics
  • Polymer Chemistry
  • Resins

Technology Areas

  • Microelectronics