Immobilization of Amines at Carbon Fiber Surfaces: Relevance to Adhesion in Carbon Fiber-Epoxy Composite Material.

Abstract

The reaction between amines acting as nucleophiles and the C-C bonds on the carbon fiber surface acting as electrophilic vinyl groups has not yet been explored. In this contribution it is demonstrated that both thermal reactions and electrochemical oxidation of amines at carbon fibers allow the covalent bonding of these molecules directly to the carbon fiber surface, presumably via nucleophilic attack of the amine at electrophilic C-C sites at the surface and subsequent formation of C-N bonds between the surface and the amine. A novel strategy for a quantitative assay of the number of amines attached to the surface is developed in which Fe(CN)6(3-) is electrostatically bound to the protonated, cationic amine sites, followed by electrochemical determination of the amount of bound Fe(CN)6 (3-) as a function of its concentration in solution. Analysis of the isotherm for this electrostatic binding process then provides the number of interfacially immobilized amines. The composition of the amine layer is also probed using X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared attenuated total reflection spectroscopy (FTIR-ATR). jg p.3

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Document Details

Document Type
Technical Report
Publication Date
Jul 29, 1995
Accession Number
ADA301983

Entities

People

  • Daniel A. Buttry
  • Jimmy C. Peng

Organizations

  • University of Wyoming

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Adhesion
  • Carbon Fibers
  • Chemical Compounds
  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Coordination Complexes
  • Electron Transfer
  • Epoxy Composites
  • Graphitic Materials
  • Materials
  • Materials Engineering
  • Materials Processing
  • Materials Science
  • Organic Chemistry
  • Shear Strength
  • X Rays

Readers

  • Polymer Science and Technology
  • Quantum Chemistry
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics