Evaluation of a Low-Density Polyimide Foam in a Dynamic, High-Temperature Environment.

Abstract

A low-density (64 kg/cu m), polyimide foam material was tested in an arc tunnel to determine its potential for heat-shield application on aerospace vehicles. The results show that the material has some reuse potential at surface temperatures as high as 750 K (0.43 cm recession in 12 000 sec). When a black refractory paint was applied to the surface of the material, the surface recession was negligible at 750 K. An analytical thermal conductivity was derived for this material which, combined with measured thermal property values, can be used to make preliminary-design thickness calculations for heat-shield applications. jg p3

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1977
Accession Number
ADA302016

Entities

People

  • Claud M. Pittman
  • Ronald D. Brown

Organizations

  • Langley Research Center

Tags

Communities of Interest

  • Engineered Resilient Systems
  • Space

DTIC Thesaurus Topics

  • Aerospace Craft
  • Ceramic Materials
  • Computer Programs
  • Conductivity
  • Dynamic Pressure
  • Emittance
  • Heat Shields
  • High Temperature
  • Low Density
  • Materials
  • Measurement
  • Mechanical Properties
  • Numerical Analysis
  • Pressure Measurement
  • Surface Temperature
  • Test And Evaluation
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Fluid Dynamics.
  • Polymer Science and Engineering.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Space
  • Space - Hall-Effect Thruster