A Review of Thermal Enhancement Coatings for Navy Standard Electronic Module Card Rails.

Abstract

The reliability of Navy standard electronic modules may be improved by decreasing overall module temperature. This may be accomplished by enhancing the thermal contact conductance at the interface between the module frame guide rib and the card rail to which the module is clamped. The surface irregularities resulting from the machining or extruding of the components cause the true contact area to be much less than the apparent contact area, increasing the contact resistance. Some metallic coatings, applied to the card rail, would deform easily under load and increase the contact area and associated conductance. This investigation evaluates possible coatings and determines those most suitable for use on card rails based upon predictions using existing theories for thermal contact conductance of coated junctions. (MM)

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Document Details

Document Type
Technical Report
Publication Date
Jul 26, 1991
Accession Number
ADA302288

Entities

People

  • L. S. Fletcher
  • M. A. Lambert

Organizations

  • Texas A&M University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Actinides
  • Aluminum Alloys
  • Chemistry
  • Equations
  • Experimental Data
  • Heat Transfer
  • Literature Surveys
  • Materials
  • Materials Science
  • Mechanical Engineering
  • Rare Earth Elements
  • Substrates
  • Surface Roughness
  • Thermal Conductivity
  • Thermophysical Properties
  • Transition Metals
  • Transuranium Elements

Readers

  • Software Engineering
  • Structural Dynamics.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics