Proceedings Fifth International Joint Military/Government-Industry
Abstract
As a result of the US Army Materiel Command's 'Adhesive Bonding Improvement Initiative,' the US Army Armament Research, Development and Engineering Center (ARDEC) and the US Army Materiels Technology Laboratory (MTL) are conducting this international symposium with the theme 'to improve the design, technology, production and testing of adhesive bonded joints for military and aerospace application'. The Army Materiel Command is placing increased emphasis on the proper application of adhesive bonding in structures and improved reliability and durability of adhesive bonded joints. Several failures of critical parts, primarily in aircraft, but also in other applications, have raised concerns that current technology may not have been properly used in design, manufacturing and quaility controls, or that new technology may be needed in other instances. Areas of interest thus run the gamut from 'high tech' surface analysis of failed parts to manufacturing methods and controls and testing. The whole picture must be considered to assure the fielding of reliable materiel which will meet military requirements. In this Fifth international Symposium on Adhesive Bonding, we are honored by the many distinguished scientists and engineers from the United States and Allied and Friendly Nations who will make presentations concerning current and future technology on structural adhesive bonding. The topics covered in this symposium include: (1)Army Materiel Command Perspectives; (2) Epoxy Systems; (3) New Polyimides; (4) Resin; (5) Fracture Mechanics; (6) Adhesion Phenomena; (7) Testing techniques; (8)Adhesion Technology; (9)Air Force Bonding Applications and Operational Experience; (10) Epoxy Adhesives for Field Repair of Military Equipment
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 05, 1987
- Accession Number
- ADA302483
Entities
Organizations
- United States Army Armament Research, Development and Engineering Center