A Thermoplastic Polyimidesulfone.

Abstract

A polymer system has been prepared which has the excellent thermoplastic properties generally associated with polysulfones, and the solvent resistance and thermal stability of aromatic polyimides. This material, with improved processability over the base polyimide, can be processed in the 260-325 deg C range in such a manner as to yield high quality, tough unfilled moldings; strong, high-temperature-resistant adhesive bonds; and well consolidated, graphite-fiber-reinforced moldings (compos- ites). The unfilled moldings have physical properties that are similar to aromatic polysulfones which demonstrates the potential as an engineering thermoplastic. The adhesive bonds exhibit excellent retention of initial strength levels even after thermal aging for 5000 hours at 232 deg C. The graphite-fiber-reinforced moldings have mechanical properties which makes this polymer attractive for the fabrication of structural composites.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1982
Accession Number
ADA302542

Entities

People

  • David A. Yamaki
  • Terry L. St. Clair

Organizations

  • Langley Research Center

Tags

Communities of Interest

  • Air Platforms
  • Space

DTIC Thesaurus Topics

  • Adhesives
  • Body Weight
  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Films
  • Flexural Strength
  • Glass Transition Temperature
  • Graphitic Materials
  • Materials
  • Materials Processing
  • Materials Science
  • Mechanical Properties
  • Mechanical Working
  • Physical Properties
  • Resins
  • Shear Strength

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.