Selected Physical and Thermal Properties of Various Formulation of Silicone Potting Compounds
Abstract
When Dow Corning discontinued production of several of their addition cured silicone potting compounds used by the DOE complex, it became necessary to develop alternate or substitute materials. This task was undertaken jointly by the Lawrence Livermore National Laboratory (LLNL) and Pantex. Several substitutes were developed and tested at both facilities. Much of this work has been reported previously. This report deals with same of the physical and thermal properties of many of these of substitutes as well of the starting materials. These substitutes were originally developed as replacements for 93-119, 93-120, 93-122 and mixtures of 93-119/93-120 and 93-119/93-122. These substitutes are based on combining various quantities of any or all of six raw materials. These materials include: Sylgard 186 - Silicone dioxide filled, high viscosity, slow curing, high strength, two part RTV. Sylgard 184 - Medium viscosity, slow curing, high strength, two part RTV. Q3-6527 Dielectric Gel-Low viscosity, very slow curing, very low strength, two part RTV. jg p.4
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1980
- Accession Number
- ADA302639
Entities
People
- Bill D. Faubion
- Gary L. Flowers
- Jackie L. Montague
- Susan T. Switzer
Organizations
- National Nuclear Security Administration