Investigation of Electronic Structure Effects in Electromigration.
Abstract
The objective of this effort was to characterize the electronic structure of metal interconnects used in microelectronic devices for the purpose of better understanding electromigration in metals. Ideally, the approach would be to use available electron structure software to determine differences in total energy and density of states for the 'ideal' metal and the 'imperfect' metal. Changes in the electronic structure would then be associated with properties of the metal and compared with experimental systems reported in the literature. This technique would form a basis for evaluating proposed metal systems prior to actual fabrication. Software available from the academic community was evaluated for suitability in the calculation of the electronic structure of microcircuit metallization. Three representative quantum chemistry software packages are described: (1) MOPAC, (2) GEOMOS, and (3) EHMACC. The limitations of the software are discussed and a suitable alternative for modeling electromigration presented.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1995
- Accession Number
- ADA304103
Entities
People
- Joseph V. Beasock
Organizations
- Rome Laboratory