Low Temperature Curing of a Nitrile-Epoxy Adhesive.

Abstract

Adhesive strength and glass transition temperature were correlated with cure times at 85 deg C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85 deg C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures. jg p4

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1981
Accession Number
ADA304422

Entities

People

  • J. S. Tira

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Adhesives
  • Bonding
  • Contractors
  • Controlled Environment
  • Dielectric Polymers
  • Environment
  • Films
  • Glass
  • Glass Transition Temperature
  • Glycidyl Ether
  • Low Temperature
  • Materials
  • Peel Strength
  • Shear Strength
  • Transition Temperature
  • United States

Fields of Study

  • Materials science

Readers

  • Mathematics or Statistics
  • Polymer Science and Engineering.
  • Surface Coatings Technology.