Electromagnetic Environmental Effects Modeling of Advanced Packaged Modules.

Abstract

This report presents the results of an investigation of electromagnetic effects in boundary scan and other scan test sturctures embedded as test access ports (TAPs). The TAPs and test scan structures of interest in this study are those used in contemporary ICs and advanced packaged MCMs to enhance testability. This effort addresses the susceptibility issues associated with embedding boundary scan test circuits in MCMs, and its effect on the latent electromagnetic susceptibility of its host linear and digital circuits.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1995
Accession Number
ADA304608

Entities

People

  • Daniel J. Kenneally

Organizations

  • SRI International

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Computer Programming
  • Computers
  • Databases
  • Digital Circuits
  • Electromagnetic Fields
  • Electromagnetic Properties
  • Electromagnetic Radiation
  • Electronic Components
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Logic Gates
  • Performance Tests
  • Reliability
  • Semiconductors
  • Test Methods
  • Three Dimensional
  • Very Large Scale Integration

Readers

  • Computer Vision.
  • Integrated Circuit Design and Technology.
  • Theoretical Analysis.