Cure Cycle Evaluation for Multilayer Printed Wiring Boards.

Abstract

The cure cycle for multilayer printed wiring boards (PWBs) made from general-purpose, fire-retardant epoxy/glass (GF) material has been evaluated for the optimum delamination resistance at soldering temperatures. The results show that, for the epoxy resin system used to manufacture multilayer PWBs at Bendix Kansas City, a wide range of cure cycle variations has a minimal effect on delamination resistance.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1980
Accession Number
ADA305065

Entities

People

  • J. W. Lula

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Contractors
  • Contracts
  • Delamination
  • Epoxy Resins
  • Glass
  • Glass Transition Temperature
  • Materials
  • Resins
  • Resistance
  • Soldering
  • Surface Finishing
  • Test And Evaluation
  • Test Methods
  • Transition Temperature
  • United States
  • United States Government

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Reinforced Composite Materials