Characterization of Fiberglass-Filled Diallyl Phthalate Plastic Molding Resins and Molded Parts,
Abstract
Characterization of diallyl phthalate (DAP) molding resins was undertaken by differential scanning calorimetry (DSC) and by combined size exclusion chromatography (SEC)/low angle laser light scattering (LALLS) in order to better predict moldability and storage life limits. Completeness of cure of molded parts, before and after any 'post-curing,' was also determined by thermal analysis. Molecular weights and molecular weight distributions of the DAP molding resins by SEC/LALLS indicated that the 'better' molding resins have lower M sub w/M sub n ratios. Association effects were observed, which could not be overcome by solvent modification alone. Determination of DAP molding resin heats of reaction by DSC indicated a linear relation between deltaH sub R and weight percent filler for the 'good' molding resins. DSC analyses of molded DAP parts showed that 95% cure was achieved in some as-molded parts, with a post-cure temperature of 165 C being required to complete the cure to 100%. Thickness of the parts was a factor, with the thicker parts being 100% cured as molded. The glass transition temperature of the molded parts increased as cure was g completed, to approx. l60-l65 C maximum. These results are consistent with a model of thermoset resin curing behavior which states that 100% cure can be achieved only if a post-curing operation is conducted above the transition temperature of the polymer.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1980
- Accession Number
- ADA305078
Entities
People
- Jerome E. Glaub
- Nicholas R. Bonekowski
- Philip D. Gillham
- Ruth B. Whitaker