Cure Analysis of An Adhesive Primer,
Abstract
Selection of a cure cycle is generally based on the results of extensive physical properties tests. The advent of dielectric analysis provides the means of accurately predicting cure schedules without this extensive testing. Dielectric analysis is based on the reaction of the dipoles within a polymer to an alternating electric field. As the field alternates the dipoles attempt to swivel in step but are restricted because of their relatively fixed position within the polymeric structure. Capacitance is the measure of the dipole's ability to align and dissipation is the power lost in alignment. For a thermosetting polymer, dissipation versus time curves provide an insight into the curing mechanism and can be correlated to known physical and chemical changes. The dissipation versus temperature curves provide a fingerprint of the curing polymer and extent of cure. jg p8
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1976
- Accession Number
- ADA305249
Entities
People
- J. M. Hubach