Dielectric Analysis of an Epoxy Preimpregnated Material.

Abstract

The introduction to the principles of dielectric analysis as it relates to the cure mechanism of a preimpregnated material is given. The relationship between dielectric behavior and polymer response is also discussed. Dissipation versus time and temperature curves are presented and their relationship to production cycles and extent of cure analysis is shown. jg p4

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1976
Accession Number
ADA305341

Entities

People

  • F. E. Meisner
  • Jason Walker
  • R. P. Hyer

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemistry
  • Contractors
  • Electric Fields
  • Electrodes
  • Epoxy Resins
  • Films
  • Materials
  • Materials Science
  • Materials Testing
  • Molecular Weight
  • Molecules
  • Physical Properties
  • Polymers
  • Resins
  • Test And Evaluation
  • Test Methods
  • United States

Readers

  • Computational Modeling and Simulation
  • Polymer Science and Engineering.
  • Superconducting Magnet Technology