The Development of Thermally Stable Adhesives for Titanium Alloy and Boron Composite Structures.
Abstract
This final report describes the work performed to develop thermally stable adhesives for bonding titanium alloy and boron composite substrates. TRW A-type polyimide technology was employed as a basis for a series of adhesive formulations evaluated for bonding titanium alloy 6A14V and boron/polyimide composites. It was shown that copolymeric blends of an A-type polyimide and amide-imide resin provided superior adhesive properties at elevated and cryogenic temperatures than state-of-the-art adhesives. Data are presented for the most promising adhesive selected during this program on long term elevated and cryogenic aging of bonded assemblies and for stress-rupture tests at elevated temperature. jg p2
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1971
- Accession Number
- ADA305345
Entities
People
- J. F. Creedon
- J. W. Goodman
- R. Jason Jones
- R. W. Vaughan
Organizations
- TRW Inc.