Ceramic/Metal Composite Circuit Board Level Technology for Application Specific Electronic Modules (ASEMs).
Abstract
The task objective was to transfer the LTCC-M technology to a merchant circuit supplier, Alcoa Electronic Packaging, Inc. This task will require a steady supply of several custom glasses that were developed during the Phase 1 program. One or more glass producers will be qualified to supply materials to the David Sarnoff Research Center or its design to produce LTCC-M circuit boards and packages. The Phase 1 technology will be interactively transferred to Alcoa Electronic Packaging, who will be qualified by the fabrication of test structures and technology demonstration modules.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 14, 1996
- Accession Number
- ADA305371
Entities
People
- A. N. Sreeram
- Barry J. Thaler
- E. S. Tormey
- J. M. Dynys
- V. A. Pendrick
Organizations
- Sarnoff Corporation