Adhesion between Polymers and Evaporated Gold and Nickel Films.
Abstract
To obtain information on the adhesion between metal films and polymeric solids, the adhesion force was measured by means of a tensile pull test. It was found that the adhesion strengths between polymeric solids and gold films evaporated on polymer substrates were (1.11 + or - 0.53)x10(exp 6) N/sq m on PTFE, about 5.49x10(exp 6) N/sq m on UHMWPE, and 6.54 x 10(exp 6) N/sq m on 6/6 nylon. The adhesion strengths for nickel films evaporated on PTFE, UHMWPE, and 6/6 nylon were found to be a factor of 1.7 higher than those for the gold-coated PTFE, UHMWPE, and 6/6 nylon. To confirm quantitatively the effect of electron irradiation on the adhesion strength between a PTFE solid and metal films, a tensile pull test was performed on the irradiated PTFE specimens, which were prepared by evaporating nickel or gold on PTFE surfaces irradiated by 2-keV electrons for various times. After irradiation, the adhesion strength increased to (4.92 + or - 0.92) x 10(exp 6)N/sq m for nickel-coated PTFE and (1.82 + or - 0.48) x 10(exp 6)N/sq m for gold-coated PTFE. The improvement in adhesion for nickel is higher than that for gold. jg p3
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1984
- Accession Number
- ADA305558
Entities
People
- Donald H. Buckley
- Donald R. Wheeler
- Yoshinori Yamada
Organizations
- Glenn Research Center