Microlithographic Mask Development (MMD).

Abstract

The contract period began with the establishment of manufacturing capability for prototype x ray mask builds by targeting both technical and manufacturing issues. By July of 1994, technical focus for x ray mask build was redefined, falling in line with optical lithography strategy. The Semiconductor Industry Association Lithography Roadmap recommended changing MMD emphasis to 0.25 and O.l8 microns generations rather than the original 0.35 and O.25 microns. Established goals were measured by following the progress of three product types: EXPO, NIGHTHAWK and TALON. The image size target for prototype masks started at O.25 microns for EXPO and progressed to 0.18 microns for NIGHTHAWK. TALON, a O.25 microns critical dimension (CD) test mask, provides a large process window for MMD learning. Engineering teams were charged with solving some major problems during the contract period.

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Document Details

Document Type
Technical Report
Publication Date
Mar 20, 1996
Accession Number
ADA305881

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Ceramic Materials
  • Compound Semiconductors
  • Contracts
  • Control Systems
  • Electron Beam Lithography
  • Fabrication
  • Laboratory Procedures
  • Lithography
  • Manufacturing
  • Materials
  • Measurement
  • Phase Shift
  • Silicon Carbide
  • Standards
  • Technology Assessment
  • Test And Evaluation

Readers

  • Aerospace Engineering
  • Defense Technology Research and Development.
  • Nanofabrication and Microfabrication.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene