Properties of Polystyrene Bead Foam as an Encapsulant for Electronic Packages.
Abstract
Polystyrene bead foam (PSBF) was evaluated as an encapsulant for electronic packages. Various properties of PSBF pertinent to the expected environmental conditioning of a prototype electronic package were determined and evaluated for their effects on individual electronic components, within the package. It was determined that PSBF densities of 0.2 to 0.4 g/cm3 provided adequate protection without damaging fragile electronic components. PSBF densities above 0.4 g/cm3 provide adequate protection from the shock and vibration spectra evaluated, but could damage fragile electronic components during the encapsulation process and thermal cycling. Buildup of electrostatic voltage during encapsulation can be reduced to safe levels by grounding the case of the electronic package. Only the 0.6 g/cm3 PSBF could be made impervious to moisture penetration. (AN)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1981
- Accession Number
- ADA306026
Entities
People
- D. C. Dyer
- D. J. Fossey
- G. D. Swanson
- K. A. Walburn
- L. L. Holland