Design Guide for Use of Polyurethane Foam as An Encapsulant for High Voltage Devices.

Abstract

A recent program has investigated the foam in place polyurethanes as encapsulants for high voltage devices that are used in the space environment. Results from this study indicate that these materials are usable for this application. Based on this study, a process for the application of these polyurethanes has been prepared. The guide lines found in this document for package design are also based on the results obtained from the referenced study and generally accepted practice.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1967
Accession Number
ADA306612

Entities

People

  • C. J. Holzbauer

Organizations

  • TRW Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • California
  • Compressive Strength
  • Contractors
  • Contracts
  • Dielectric Permittivity
  • Dielectric Strength
  • Dissipation Factor
  • Electrical Properties
  • Frequency
  • High Voltage
  • Materials
  • Mechanical Properties
  • Physical Properties
  • Polyurethanes
  • Resonant Frequency
  • Space Environments
  • United States

Fields of Study

  • Materials science

Readers

  • Instructional Design and Training Evaluation.
  • Petroleum Engineering
  • Semiconductor Device Technology

Technology Areas

  • Space