Embedding Materials for Modular Assemblies: A Partially Annotated Bibliography.

Abstract

Modular packaging of electronics assemblies is a means of enhancing the dependability of equipment which is designed to operate in extreme environments. The proper selection of a plastic embedding material for a particular situation is, therefore, an important aspect in the design of dependable modules. The primary purpose of this bibliography is that of providing information on materials which can be utilized for the embedment of electronics assemblies. References are arranged alphabetically by author. Separate indexes for corporate author, secondary author, and subject are included at the end of the bibliography. The period of coverage dates from 1950 through June 1962.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1963
Accession Number
ADA307119

Entities

People

  • C. M. Pierce

Organizations

  • Lockheed Martin Missiles and Space

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Alkenes
  • Biomedical And Dental Materials
  • Chemical Synthesis
  • Chemistry
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Organic Chemistry
  • Plasticizers
  • Plastics
  • Polymer Chemistry
  • Polymeric Films
  • Reinforced Plastics
  • Resins

Readers

  • Artificial Intelligence
  • Library and Information Science
  • Software Engineering

Technology Areas

  • Microelectronics