Cryogenic/High Temperature Structural Adhesives.

Abstract

This Final Report describes the work performed during this program to develop a structural adhesive system which possesses useful properties over a 20 deg K (-423 deg F) to 589 deg K (600 deg F) temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ II (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1974
Accession Number
ADA307453

Entities

People

  • C. H. Sheppard
  • R. W. Vaughan

Organizations

  • TRW Inc.

Tags

Communities of Interest

  • Air Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Chemical Synthesis
  • Chemistry
  • High Temperature
  • Jet Propulsion
  • Materials
  • Materials Laboratories
  • Materials Science
  • Military Research
  • Polyimide Resins
  • Shear Strength
  • Shear Stresses
  • Shear Tests
  • Space Shuttles
  • Stainless Steel
  • Test And Evaluation
  • Titanium Alloys

Readers

  • Polymer Science and Engineering.
  • Structural Health Monitoring of Composite Structures.