Techniques and Applications for Bonding and Sealing Teflon 100 FEP Resin,

Abstract

This report summarizes various techniques for bonding and sealing Teflon(R) 100 FEP resin to itself and to other materials. Techniques included are: (1) bonding to flat surfaces, (2) encapsulation and sealing to metal shapes, and (3) special techniques such as spin welding, film wrapping, hot gas welding, and heat shrinking. Typical applications where a bond or seal is important are discussed. p1

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1961
Accession Number
ADA307535

Entities

People

  • E. A. Stecca

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesives
  • Coatings
  • Compression
  • Construction
  • Electrical Properties
  • Electronic Equipment
  • Encapsulation
  • Films
  • Fluoropolymers
  • Gases
  • Hermetic Seals
  • Hot Gases
  • Induction Heating
  • Laminates
  • Manufacturing
  • Materials
  • Peel Strength

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Polymer Science and Engineering.