Comparative Rheological and Fracture Properties of Epoxy Resins in the Glass Transition Region,

Abstract

The rheological and fracture properties of technically and commercially important representatives of three classes of high polymers, elastomer (SBR), thermoplastics (PVC), and thermosetts (epoxy resins) are directly compared in terms of response 'master' functions in the region from glassy state through rubbery state. Application of the time temperature reduced variables treatment reduces the magnitudes of response to thermodynamically equivalent states at 296 K. The rheological time scale of response is reduced to equivalent states of molecular fractional free volume, from a further consideration of reduced variables, fixed by convention at T sub g + 50 K where T is the glass transition temperature of the particular polymer g. The dynamic properties, in terms of the storage modulus and loss tangent and tensile properties, in terms of a relaxation modulus, the true fracture stress and fracture strain are qualitatively compared and discussed from the standpoint of chemical composition and macromolecular architecture. The interrelations between microstrain dynamic properties and macrostrain tensile deformation and fracture properties are identified.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1960
Accession Number
ADA307549

Entities

People

  • D. H. Kaelble

Organizations

  • 3M

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Chemical Composition
  • Epoxy Resins
  • Equations
  • Glass Transition Temperature
  • Materials
  • Mechanical Properties
  • Mechanics
  • Physical Properties
  • Plastics
  • Resins
  • Stresses
  • Tensile Properties
  • Tensile Strength
  • Thermoplastic Resins
  • Thermosetting Plastics
  • Transition Temperature

Fields of Study

  • Materials science

Readers

  • Control Systems Engineering.
  • Materials Science (Mechanical Engineering).
  • Polymer Science and Engineering.