Processing of Interconnected Glass and Ceramic Composites for Electronic Packaging.
Abstract
Glasses and glass-ceramics are well known for their low dielectric constant (epsilon approx. 3-5) at 1MHz which make them useful substrate materials for high speed electronic packaging. On the other hand, crystalline ceramics such as AlN have moderate dielectric constants (epsilon approx. 9-12) at 1MHz high thermal conductivity useful for high power packages. Porous and glass infiltrated ceramic composites with interconnected high thermal conductivity phases therefore, have the potential of possessing optimum dielectric constant (approx. 5) and thermal conductivity (approx.20-60 W/m-K) for substrate applications. This report discusses the results of the work conducted in processing interconnected porous composites of AlN, and also low dielectric constant glasses and glass- ceramics in the B2O3-P2O5-SiO2 system. A systematic investigation has been conducted to study the effect of pre-treatment of AlN powders in ammonia on their sinterability. At the same time, the combined effects of this pretreatment and the influence of volume fraction on thermal conductivity has been studied. Similarly, studies have been conducted to understand the structure of the oxide glasses, their sinterability, and the effect of nitrogen substitution on their dielectric constant.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 09, 1996
- Accession Number
- ADA311790
Entities
People
- Prashant N Kumta
Organizations
- Carnegie Mellon University