MEMS Integration for a Range of Tire Pressure Devices.

Abstract

This project investigates the feasibility of an innovative design for a retrofittable tire pressure measuring sensor integrated circuit and packaging. The device when developed and marketed will allow consumers and commercial transportation users to easily and effortlessly determine when to reinflate their tires. The projected savings in energy costs and reduction in air pollutants generated are 2% to 8% per vehicle. With approximately 150 million North American vehicles and an equal number in Japan and Europe, the commercial potential and air quality benefit can be tremendous. The feasibility study investigated passenger car, truck, and aircraft tire applications. The project reported on designs and analytical results obtained in studies of comer compensation for anisotropic etch with KOH, surface micro machined capacitor sensing mechanisms, and charge redistribution CMOS analog processing. The designs investigated a subminiature pressure transducer package which provides a unique interface between sensor and tire. Finite element modeling results of the package and MEMS integrated circuit revealed a robust structural design. Spice simulation of the analog circuit showed acceptable performance. The report also identifies key work to be accomplished in order to complete development. Further development was recommended.

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Document Details

Document Type
Technical Report
Publication Date
Aug 22, 1996
Accession Number
ADA313436

Entities

People

  • James C. Marshall
  • Ronald D. Widner

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Accuracy
  • Actuators
  • Aircrafts
  • Assembly
  • Construction
  • Electronic Circuits
  • Electronics
  • Fabrication
  • Manufacturing
  • Measurement
  • Microelectromechanical Systems
  • Micromachining
  • Pressure Measurement
  • Semiconductors
  • Test And Evaluation
  • Three Dimensional
  • Transducers

Readers

  • Fluid Dynamics.
  • Integrated Circuit Design and Technology.
  • Pavement Materials Engineering.