Simulation of Droplet Evaporation in Supercritical Environments Using Parallel Molecular Dynamics.

Abstract

The complete evaporation of three-dimensional submicron droplets under both subcritical and supercritical conditions has been modeled using molecular dynamics (MD). This work represents a first step toward an accurate analytical modeling of combustion in supercritical environments. In this initial study the two-phase simulations consist entirely of argon atoms distributed between a single droplet and its surrounding vapor. The inter-atomic forces are based on a Lennard-Jones 12-6 potential, and the resultant atomic displacements are determined using a modified velocity Verlet algorithm. Linked cell lists in combination with Verlet neighbor lists allow efficient modeling of the large and diverse simulations. A non-cubic periodic boundary, specifically a truncated octahedron, is used to minimize periodicity effects. A unique method, using the linked cell structure, streamlines the associated boundary computations. The linked cells are also used as domains for density, temperature and surface tension computations. This allows a contouring of these properties. The surface tension measure is a unique development. p7

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1996
Accession Number
ADA318725

Entities

People

  • Jeffery K. Little

Organizations

  • Pennsylvania State University

Tags

Communities of Interest

  • Energy and Power Technologies
  • Materials and Manufacturing Processes
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Computer Programming
  • Computers
  • Critical Temperature
  • Crystal Structure
  • Heat Energy
  • Heat Of Vaporization
  • Heat Transfer
  • Isotherms
  • Latent Heat
  • Lists (Data Structures)
  • Molecular Dynamics
  • Parallel Computing
  • Phase Transformations
  • Thermodynamics
  • Three Dimensional
  • Vaporization

Readers

  • Combustion science or combustion engineering.
  • Computational Modeling and Simulation
  • Materials Science and Engineering.