Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs).

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Technology Transfer to Merchant Suppliers, Customize LTCC-M for Specific Applications, and Fabrication and Testing of Technology Demonstration Modules.

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Document Details

Document Type
Technical Report
Publication Date
Dec 11, 1996
Accession Number
ADA320234

Entities

People

  • A. N. Sreeram
  • B. J. Thaler
  • E. S. Tormey
  • M. Liberatore
  • P. Palanisamy

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Accuracy
  • Air Flow
  • Amplifiers
  • Assembly
  • Circuit Boards
  • Composite Materials
  • Electrical Properties
  • Fabrication
  • Manufacturing
  • Melting Point
  • Metal Matrix Composites
  • Power Amplifiers
  • Technology Transfer
  • Test And Evaluation
  • Test Equipment
  • Test Fixtures
  • Thick Films

Readers

  • Integrated Circuit Design and Technology.
  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.

Technology Areas

  • Microelectronics